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DATA SHEET
OCMOS FETTM
PS7341-1B,PS7341L-1B
HIGH ISOLATION VOLTAGE 6-PIN DIP OCMOS FET (1-ch OCMOS FET)
DESCRIPTION
The PS7341-1B and PS7341L-1B are solid state relays containing a GaAs LED on the light emitting side (input side) and normally close (N.C.) contact MOS FETs on the output side. They are suitable for analog signal control because of their low offset and high linearity. The PS7341L-1B has a surface mount type lead.
FEATURES
* High isolation voltage (BV = 3 750 Vr.m.s.) * 1 channel type (1 b output) * Low LED Operating Current (IF = 2 mA) * Designed for AC/DC switching line changer * Small package (6-pin DIP) * Low offset voltage * PS7341L-1B: Surface mount type * UL approved: File No. E72422 (S) * BSI approved: No. 8252/8253 * CSA approved: CA 101391
APPLICATIONS
* Exchange equipment * Measurement equipment * FA/OA equipment
The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version.
Not all devices/types available in every country. Please check with local NEC representative for availability and additional information.
Document No. P14229EJ1V0DS00 (1st edition) Date Published June 1999 NS CP(K) Printed in Japan
(c)
1999
PS7341-1B,PS7341L-1B
PACKAGE DIMENSIONS (in millimeters)
PS7341-1B
9.250.5 6 5 4
TOP VIEW
1. 2. 3. 4. 5. 6. LED Anode LED Cathode NC MOS FET Drain MOS FET Source MOS FET Drain
1
2
3
7.62 6.50.5
3.30.3 4.150.3 3.50.3
0.50.1 1.340.1 0.25 M
0 to 15 2.54
PS7341L-1B
9.250.5 6 5 4
TOP VIEW
1. 2. 3. 4. 5. 6. LED Anode LED Cathode NC MOS FET Drain MOS FET Source MOS FET Drain
1
2
3
6.50.5
3.50.3 0.10+0.10 -0.05
1.340.1 0.25 M
2.54
0.90.25 9.600.4
2
Data Sheet P14229EJ1V0DS00
PS7341-1B,PS7341L-1B
ORDERING INFORMATION
Part Number PS7341-1B PS7341L-1B PS7341L-1B-E3 PS7341L-1B-E4 Embossed Tape 1 000 pcs/reel Package 8-pin DIP Packing Style Magazine case 50 pcs Application Part Number PS7341-1B PS7341L-1B
*1
*1 For the application of the Safety Standard, following part number should be used.
ABSOLUTE MAXIMUM RATINGS (TA = 25 C, unless otherwise specified)
Parameter Diode Forward Current (DC) Reverse Voltage Power Dissipation Peak Forward Current MOS FET Break Down Voltage Continuous Load Current
*2 *1
Symbol IF VR PD IFP VL Connection A Connection B Connection C IL
Ratings 50 5.0 50 1 400 150 200 300
Unit mA V mW A V mA
Pulse Load Current (AC/DC Connection) Power Dissipation Isolation Voltage
*4
*3
ILP PD BV PT TA Tstg
300 560 3 750 610 -40 to +85 -40 to +125
mA mW Vr.m.s. mW C C
Total Power Dissipation Operating Ambient Temperature Storage Temperature
*1 PW = 100 s, Duty Cycle = 1 % *2 Conditions: IF 2 mA. The following types of load connections are available.
1 2 3 1 2 3 1 2 3 1 2 3 6 5 4 6 5 4 6 5 4 6 5 4 IL IL L L IL + IL IL - + VL (DC) + VL (DC) - IL VL (AC/DC) L L + VL (DC) -
A
IL
B
C
*3 PW = 100 ms, 1shot *4 AC voltage for 1 minute at TA = 25 C, RH = 60 % between input and output
Data Sheet P14229EJ1V0DS00
3
PS7341-1B,PS7341L-1B
RECOMMENDED OPERATING CONDITIONS (TA = 25 C)
Parameter LED Operating Current LED Off Voltage Symbol IF VF MIN. 2 0 TYP. 10 MAX. 20 0.5 Unit mA V
ELECTRICAL CHARACTERISTICS (TA = 25 C)
Parameter Diode Forward Voltage Reverse Current MOS FET Off-state Leakage Current Output Capacitance Coupled LED Off-state Current On-state Resistance Symbol VF IR ILoff Cout IFoff Ron1 Ron2 Turn-on Time Turn-off Time
*1
Conditions IF = 10 mA VR = 5 V IF = 10 mA, VD = 400 V IF = 10 mA, VD = 0 V, f = 1 MHz IL = 150 mA IF = 0 mA, IL = 10 mA IF = 0 mA, IL = 150 mA IF = 10 mA, VO = 5 V, PW 10 ms
MIN.
TYP. 1.2
MAX. 1.4 5.0
Unit V
A A
pF
0.5 185
10
2.0 20 16 0.03 0.6 30 25 0.2 1.5
mA
ton toff RI-O CI-O
ms
*1
Isolation Resistance Isolation Capacitance
VI-O = 1.0 kVDC V = 0 V, f = 1 MHz
10
9
1.1 pF
*1 Test Circuit for Switching Time
IF Pulse Input VL
Input
50 % 0
VO = 5 V
Input monitor Rin RL VO monitor
90 %
Output 10 % toff ton
4
Data Sheet P14229EJ1V0DS00
PS7341-1B,PS7341L-1B
TYPICAL CHARACTERISTICS (TA = 25 C, unless otherwise specified)
MAXIMUM FORWARD CURRENT vs. AMBIENT TEMPERATURE
100
Maximum Forward Current IF (mA) Maximum Load Current IL (mA)
MAXIMUM LOAD CURRENT vs. AMBIENT TEMPERATURE
300
80
200
60
40
100
20
0 -25
0
25
50
75 85
100
0 -25
0
25
50
75 85
100
Ambient Temperature TA (C)
Ambient Temperature TA (C)
FORWARD VOLTAGE vs. AMBIENT TEMPERATURE
1.8
Output Capacitance Cout (pF)
OUTPUT CAPACITANCE vs. APPLIED VOLTAGE
200 f = 1 MHz
Forward Voltage VF (V)
1.6
1.4
IF = 50 mA 30 mA 20 mA 10 mA 5 mA 1 mA
150
100
1.2
1.0
50
0.8 -25
0
25
50
75
100
0
20
40
60
80
100
120
Ambient Temperature TA (C)
Applied Voltage VD (V)
OFF-STATE LEAKAGE CURRENT vs. APPLIED VOLTAGE
10-4
Off-state Leakage Current ILoff (A)
LOAD CURRENT vs. LOAD VOLTAGE
200 IF = 0 mA
TA = 80 C
Load Current IL (mA)
10-5
100
10-6
25 C
-4.0
-2.0 -100
0
2.0
4.0
10-7
10-8 0
100
200
300
400
500
-200 Load Voltage VL (V)
Applied Voltage VD (V)
Data Sheet P14229EJ1V0DS00
5
PS7341-1B,PS7341L-1B
NORMALIZED ON-STATE RESISTANCE vs. AMBIENT TEMPERATURE
3.0
ON-STATE RESISTANCE DISTRIBUTION
30 n = 50 pcs, IF = 0 mA, IL = 10 mA
Normalized On-state Resistance Ron
2.5 2.0 1.5 1.0 0.5 0.0 -25
Normalized to 1.0 at TA = 25 C, IF = 0 mA, IL = 10 mA
25
Number (pcs)
20 15 10 5 0
0
25
50
75
100
20
21
Ambient Temperature TA (C)
On-state Resistance Ron ()
TURN-ON TIME vs. FORWARD CURRENT
0.30 VO = 5 V 0.25
TURN-OFF TIME vs. FORWARD CURRENT
12 VO = 5 V 10
Turn-on Time ton (ms)
Turn-off Time toff (ms)
0.20 0.15 0.10 0.05
8 6 4 2
0
5
10
15
20
25
30
0
5
10
15
20
25
30
Forward Current IF (mA)
Forward Current IF (mA)
TURN-ON TIME DISTRIBUTION
30 25 n = 50 pcs, IF = 10 mA, VO = 5 V 30 25
TURN-OFF TIME DISTRIBUTION
n = 50 pcs, IF = 10 mA, VO = 5 V
Number (pcs)
15 10 5 0
Number (pcs)
20
20 15 10 5 0
0.03
0.05
0.5
0.7
Turn-on Time ton (ms)
Turn-off Time toff (ms)
6
Data Sheet P14229EJ1V0DS00
PS7341-1B,PS7341L-1B
NORMALIZED TURN-ON TIME vs. AMBIENT TEMPERATURE
3.0
Normalized Turn-on Time ton Normalized Turn-off Time toff
NORMALIZED TURN-OFF TIME vs. AMBIENT TEMPERATURE
3.0 Normalized to 1.0 at TA = 25 C, IF = 10 mA, VO = 5 V
2.5 2.0 1.5 1.0 0.5 0.0 -25
Normalized to 1.0 at TA = 25 C, IF = 10 mA, VO = 5 V
2.5 2.0 1.5 1.0 0.5 0.0 -25
0
25
50
75
100
0
25
50
75
100
Ambient Temperature TA (C)
Ambient Temperature TA (C)
Remark The graphs indicate nominal characteristics.
Data Sheet P14229EJ1V0DS00
7
PS7341-1B,PS7341L-1B
TAPING SPECIFICATIONS (in millimeters)
Outline and Dimensions (Tape)
2.00.1 4.00.1
1.750.1
1.550.1
4.30.2
16.00.3 10.30.1
7.50.1
1.550.1 12.00.1
10.40.1
0.3
Tape Direction
PS7341L-1B-E3 PS7341L-1B-E4
Outline and Dimensions (Reel)
1.5
2.00.5 13.00.5
R 1.0
21.00.8
80.05.0
330
16.4 +2.0 -0.0
Packing: 1 000 pcs/reel
8
Data Sheet P14229EJ1V0DS00
PS7341-1B,PS7341L-1B
RECOMMENDED SOLDERING CONDITIONS
(1) Infrared reflow soldering * Peak reflow temperature * Time of temperature higher than 210 C * Number of reflows * Flux 235 C (package surface temperature) 30 seconds or less One Rosin flux containing small amount of chlorine (The flux with a maximum chlorine content of 0.2 Wt % is recommended.)
Recommended Temperature Profile of Infrared Reflow
Package Surface Temperature T (C)
(heating) to 10 s 235 C (peak temperature) 210 C to 30 s 120 to 160 C 60 to 90 s (preheating)
Time (s)
(2) Dip soldering * Temperature * Time * Number of times * Flux 260 C or below (molten solder temperature) 10 seconds or less One Rosin flux containing small amount of chlorine (The flux with a maximum chlorine content of 0.2 Wt % is recommended.) (3) Cautions * Fluxes Avoid removing the residual flux with freon-based and chlorine-based cleaning solvent. * Products in dry pack After opening the dry pack, solder the products within the valid storage period specified on the label on the dry pack.
Data Sheet P14229EJ1V0DS00
9
PS7341-1B,PS7341L-1B
[MEMO]
10
Data Sheet P14229EJ1V0DS00
PS7341-1B,PS7341L-1B
[MEMO]
Data Sheet P14229EJ1V0DS00
11
PS7341-1B,PS7341L-1B
CAUTION
Within this device there exists GaAs (Gallium Arsenide) material which is a harmful substance if ingested. Please do not under any circumstances break the hermetic seal.
OCMOS FET is a trademark of NEC Corporation.
* The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version. * No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in this document. * NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from use of a device described herein or any other liability arising from use of such device. No license, either express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC Corporation or others. * Descriptions of circuits, software, and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. The incorporation of these circuits, software, and information in the design of the customer's equipment shall be done under the full responsibility of the customer. NEC Corporation assumes no responsibility for any losses incurred by the customer or third parties arising from the use of these circuits, software, and information. * While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices, the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or property arising from a defect in an NEC semiconductor device, customers must incorporate sufficient safety measures in its design, such as redundancy, fire-containment, and anti-failure features. * NEC devices are classified into the following three quality grades: "Standard", "Special", and "Specific". The Specific quality grade applies only to devices developed based on a customer designated "quality assurance program" for a specific application. The recommended applications of a device depend on its quality grade, as indicated below. Customers must check the quality grade of each device before using it in a particular application. Standard: Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) Specific: Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems or medical equipment for life support, etc. The quality grade of NEC devices is "Standard" unless otherwise specified in NEC's Data Sheets or Data Books. If customers intend to use NEC devices for applications other than those specified for Standard quality grade, they should contact an NEC sales representative in advance.
M7 98. 8

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